Press Release
Recent articles and conferences
- IEEE ITC Conference Keynote, 2025 — AI chip architectures for acceleration (YouTube)
- IEEE IEDM Conference — Short course on AI market, architectures and road forward (course handout)
- Semiconductor Industry Association Webinar — AI chip market, 2024
- WSTS Fall Meeting, 2024 — Why communication matters in data center AI infrastructure
- MWC GLOMO Awards judge, 2023–2025 — Evaluated Best AI Application for the GLOMO Awards at Mobile World Congress, 2024
- NASSCOM interview, 2023 — AI use cases and applications in pharma
- ValleyML Expo, June 2022, investor panel — “Future of AI start-ups”
- ValleyML Expo, June 2022, moderator — “Lessons learned in productizing vision applications”
- Analyst comments on Enterprise AI, 2021 (Global Chip Shortage Is Negatively Impacting AI Workloads in the Cloud)
- Global Data Conference Presentation ‘Secrets of monetizing video with AI’ 2021 (LinkedIn)
- Overview on AI chipset report via Omdia 2020 (Omdia brochure)
- Edge AI Alliance article (Is NVIDIA moving toward AI chipset world domination?)
- IEEE/ValleyML summit 2020 panel: ‘Where are all the Sub 1W chipsets, needed for AI at the Edge’ (ValleyML)
- Edge AI summit 2020 presentation — Thick, thin, ultra thin nodes of Edge AI
- IEEE Seminar “State of AI/ML” — Technologies and architectures for AI/ML acceleration
- Edge AI Summit 2019 Panel Speaker: “Power Play in edge AI market”
- RISC-V Summit 2019: “Challenges and Opportunities for RISC V” (slides)
- Semiconductor Packaging Society 2019: “Opportunities created by AI chipsets in semiconductor manufacturing” (PDF)
- Quoted in EE News 2019 (AI chip market set to rival microcontrollers)
- Report in 3D InCites 2019 (Neural networks and SoC design challenges)
- Chair Technology Track AI Summit San Francisco 2018
- Edge AI alliance blog (Evolution of AI applications)
- Interviewed by Computer Vision Magazine 2018
- IIT Hyderabad Invited Speech 2018 — Accelerating AI algorithms in hardware
- White Paper — Pure Storage 2018 — Importance of AI for Storage Applications
- HardwareCon Presentation — Opportunities for Entrepreneurs in Computer Vision
- Interview by ACM Communications Magazine 2018 — State of the 3D Sensing Technology
- Interview in NASA Tech Brief (2015)
- Quoted in Bloomberg about Movidius (2017) (This chip can make security cameras smart)